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ANDevices offers several fully automated alignment & testing systems developed based upon over 60 man-years of experience. They are used in aligning and bonding V-grooved fiber blocks to planar optical splitter or AWG chips. These bonders have 6 degrees of freedom in maneuvering using nanotrak controllers to achieve precision alignment with high throughput. These systems are also provide solutions for fiber alignment and attachment to custom chips.

PLC chip size from 1x4 planar splitter (2.5mm x 10mm x 2.1mm) to large AWG chips
Fiber attachment services with SM (single-mode), PM (polarization maintaining) or custom fiber arrays up to 80 channels
Design and assembly of custom packaging
Thermal modeling of custom packaging
Measurement Services
Telcordia testing and other reliability services

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